Development service scope

H/W Development

  • Digital & Analog electronic Schematic
  • MCU, FPGA, DSP control Schematic
  • LPDDR4~5, eMMC, NAND, Serial ROM, Micro SD, etc. Memory Schematic
  • Wi-Fi 802.11 a/b/g/n/ac, Bluetooth, LTE & LTE Cat M1, Sub 1G, Ether CAT, Modbus, RS-232, RS-485, CAN BUS, TCP/ IP, USB, MIPI C & D, eDP, etc. Wired & Wireless communication Schematic
  • Audio & MIC, Camera, Touch LCD Schematic
  • Motor / Pump / Valve control Schematic (DC, AC, Step, BLDC)
  • Sensor control Schematic (Pressure, Temperature, Humidity, Gas, Detection, Gyro, Speed, etc.)
  • SMPS & etc Power Schematic
  • FPGA logic Design (Xilinx, Altera, Evos)
  • Development of product mass production quality reliability support (including CE, UL & FCC electromagnetic wave certification)

S/W Development

  • Firmware (STM, AVR, PIC, TI, NXP i.MX6~8, RK3399, ARM Cortex M3~M7)
    Raspberry Pi & Arduino Programming
  • DSP Programming(TI, ADI)
  • Embedded Linux / Android / WinCE OS Porting & Device Driver
  • PC & Mobile APP
  • SERVER Program
  • C++ , JAVA
  • Oracle DB
  • VISA Library
  • Visual Studion, NetBeans, Toad(D/B)

Product & Mechanical Design & Manufacturing

  • Product Design
  • System Integration Design
  • 2D CAD & 3D Modeling
  • Design Sample Manufacturing
  • Working Mock-Up Manufacturing
  • Injection Mold Manufacturing
  • Sheet Metal Fabrication, Press Injection, Die Casting
  • Creo 3 0 / 3D CAD

PCB Design / SI,PI 3D Analysis

PCB Design

  • SI, PI 3D Simulation Analysis Base PCB
  • Substrate Package PCB
    – Min Trace 15um, Drill Via 80um
  • 0.3mm Pitch BGA PCB
  • Build-Up PCB
    – Stack Via, Outer Layer Trace/Space 75/75um
    – Inner Layer Trace/Space 50/50um,
    – Max 14 Layer
    – Max PCB Thickness 1.6T
  • PCB for special purposes such as Automotive, Defense industry, Aviation, Ships, Satellites
  • Ceramic PCB, Metal PCB, Cu 10Oz PCB
  • Allegro 16.6 ~ 17.2
  • PADS PowerPCB
  • OrCAD Capture

SI, PI 3D Analysis

  • Allegro PCB SI / PI , Power SI / Power DC
  • Mentor Hyper Lynx SI / PI
  • HFSS / Slwave / Design

Test JIG Development

  • Power short  & voltage/current Test
  • Firmware & MAC Download, operation check and function Test
  • Chip debugging & communication test, connector connection Test
  • Development of test JIGs according to customer specifications
  • Press JIG, simple standing JIG, air press JIG
  • Connector connection JIG, replacement JIG
  • Hand press top gun type JIG
  • Utilizes hydraulic and pneumatic motors
  • Integrated or separate design possible depending on order specifications
  • SUS, Aluminum, Acrylic, Bakelite, Nickel, Plating
  • Anodizing, Painting, Sheet metal, Mold
  • 2D AutoCAD

Certification Support

  • Pre-Test
  • Electrical appliance stability Test
  • Electromagnetic Compatibility Test
  • LVD (CE stability certification)
  • EMC (CE Electromagnetic Certification)
  • UL & FCC Certified

CE, UL & FCC certification and pre-test support are provided only when you request development services from MTech.

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