PCB Manufacturing

High reliability, excellent quality, semiconductor, special industrial and build-up PCB supply

High Reliability, Excellent Quality, SemiconductorㆍSpecial industrial and Build-up PCB Supply

Semiconductor verification of memory, LSI, ASIC, MPW, etc.ㆍApplicationㆍMountingㆍReliability Test PCB, Substrate Packaging PCB
Automotive ElectronicsㆍDefense industryㆍAviation(Drone)ㆍShip & Ports, etc. Special PCB, electricaㆍelectronic industry
Build-up PCB, Flex PCB, RF-PCB, Impedance PCB, Metal PCB, Ceramic PCB
Supply of 1~70 layer sample PCB and mass production PCB

MTech Manufacturable Capable PCB Specifications

MTech Manufacturing Capable PCB Specifications

Item	Specifications
Layer	1L~70L
Size	650x600mm
Thickness	0.2mm ~ 6.8mm
Pitch	0.4Pitch(@3.2~3.8mmT)
Impedance	±5 ~ 10%
Gold plating Thickness	ENIG/Electro Gold 0.03~1.5um
Min Trace Width	15㎛(Substrate) 50㎛ (Inner Layer)
Option	BVH, IVH, HPL, Back Drilling, Build-Up, Substrate
Via hole size	Min 0.15 ~ 0.3mm
Surface treatment	ENIG / E-less Gold / Electro Gold

Item	Specifications
Drilled to Copper	0.1 (DUT Area) 0.15(Other Area)
Stacked Microvias	Yes
Back Drill	0.3Pitch
Laser Drilled Micro vias	0.08 ~ 0.1
Blind Mechanical Vias	0.12
Solder Mask Dam	Min 0.1
Routing tolerance	±0.1mm
External Trace / Space Internal Trace / Space Surbstrate Trace / Space	0.75 / 0.75 0.050 / 0.050 0.15 / 0.15
Max Panel Siz	600X780mm

PCB material	FR-4, FR-4Hi-Tg, 185HR, N4000-13, N4000-13SI, Epoxy, Composite, Flexible, Teflon, Metal, Isola I-Tera, Polymide, Megatro6~7, DS-7402C, Ceramic

Substrate PCB manufacturing for semiconductor packages
BGA 0.3mm~0.35mm pitch PCB manufacturing
Cu 10Oz PCB Manufacturing

Basic Manufacturable PCB Material Specifications

Raw materials name	manufacturing company	Material name	Dielectric Constant(Dk) @10GHz (@1GHz)	Dissipation Factor(Df) @10GHz (@1GHz)	Tg @DMA	Areas of application
FR-4 High-Tg	EMC	EM-827(I)	(4.3)	(0.019)	185℃	Consumer electronics,Automotive, Server & Computer
FR-4 Halogen-Free	DOOSAN	DS-7402	4.21 (4.33)	0.014 (0.013)	165℃	Smart Device - Mobile, Consumer Electronics Automotive - ECU / DCU / TCU
FR-4 Halogen-Free		DS-7402LC	4.1 (4.23)	0.008 (0.007)	175℃	Smart Device - Mobile, Consumer Electronics, Memory module & SSD
FR-4 High-Tg		DS-7409S(N)	3.56 (4.3)	0.019 (0.016)	190℃	Networks Equipment - Enterprise/Carrier Router & Switch
FR-4 High-Tg		DS-7409HG(LE)	4.1 (4.2)	0.008 (0.007)	240℃	IC Package Substrate- Memory - NAND Flash
Low CTE BT	MGC(MITSUBISHI GAS CHEMICAL)	HL832NSF (Core)	3.9(4.0)	0.006(0.008)	300℃	IC Package - Substrate - LSI & Memory - Flip Chip Package, CSP, BGA, etc.
Low CTE BT	MGC(MITSUBISHI GAS CHEMICAL)	GHPL830NSF (PPG & Build-up)	3.4(3.5)	0.009(0.007)	300℃
NELCO	AGC INC	N4000-13	3.6 (3.7)	0.009(0.009)	240℃	High Speed Semiconductor Test, High-speed storage network, Internet Switch/Routing system, Wireless communication infrastructure, Backplane
NELCO	AGC INC	N4000-13 SI	3.2 (3.4)	0.008(0.008)	240℃
I-Tera	Isola	MT40	3.45(5GHz)	0.0031(5GHz)	230℃	Medical, Industrial & Instrumentation, Aerospace & Defense, Computing, Storage & Peripherals, Networking & Communication Systems, Automotive & Transportation
MEGTRON6	PANASONIC	R-5775_(Laminate)	3.39~3.94 (13~56GHz)	0.0044~0.0072 (13~56GHz)	210℃	Gen5 I/F Board, Load Board (SOC Type Mother Board), ICT infrastructure equipment, Measuring instrument, Antenna (Base station, Automotive millimeter-wave radar), Etc
MEGTRON6	PANASONIC	R-5670_(Prepreg)	3.21~3.62 (13~56GHz)	0.0044~0.0072 (13~56GHz)	210℃
MEGTRON7	PANASONIC	R-5785N_(Laminate)	3.11~3.37 (14~59GHz)	0.0021~0.0033 (14~59GHz)	210℃
MEGTRON7	PANASONIC	R-5680N_(Prepreg)	3.09~3.37 (14~59GHz)	0.0020~0.0032 (14~59GHz)	210℃

📌 Scroll horizontally to access additional information.

Description of materials available for PCB fabrication

Description of materials available for PCB Manufacturing

FR-4	The substrate characteristics of multiple layers of glass fiber impregnated with epoxy resin meet most electrical and physical needs and can be applied to most products.
FR-4 Hi-Tg	Substrate with higher Tg than FR-4. Glass transition temperature of 170ºC, improved heat resistance
N4000-13 SI	Low Permittivity, Excellent price / Performance is good
Epoxy	A substrate made by synthesizing and laminating epoxy resin on glass fiber. It has excellent electrical properties, excellent dimensional stability, and excellent heat and chemical resistance.
Composite	A substrate made by synthesizing and stacking two or more materials. You can combine them to suit your desired characteristics.
Flexible	Copper foil is coated on polyester or polyimide film for excellent insulation and heat resistance and free design
Teflon	High-frequency PCB design using Teflon as an insulator, easy impedance adjustment, excellent electrical stability and heat resistance
METAL	This is a board made by anodizing an aluminum plate capable of high frequency and high heat dissipation and then bonding copper foil to it.
Polyimide	A substrate made by laminating polyimide film and copper foil without using adhesives. Excellent bending strength and flexibility, excellent thermal stability, and excellent abrasion resistance.
Isola I-Tera	It is a material suitable for high-speed digital and RF/microwave applications and has stable electrical characteristics over a wide frequency and temperature range.
Megatro6	A high-speed, low-loss multi-layer material designed for high-speed network equipment, mainframes, IC testers, and high-frequency measurement devices.
DS-7402C	Higher thermal properties than existing lead-free FR-4 (above 170℃), excellent chemical and heat resistance, UV blocking and AOI compatibility, Build-Up PCB Material
Ceramic	We can supply a variety of ceramic PCBs, including DCB boards made from alumina (AI2O3) and aluminum nitride (AIN). Compared to general PCB boards, it has high thermal conductivity, excellent dielectric properties, high electrical insulation strength, stable chemical properties, strong corrosion resistance, and excellent reliability under high temperature and high pressure conditions, so it is mainly used for power industry, home appliances, industrial use, defense and aerospace, automotive, medical, etc. Applies.

PCB type

PCB Type

Single Side	Double Side	Multy Layer	Impedance	FPCB	Rigid FPCB	Metal	Package Substrate	Ceramic

schematic pattern configuration on one side Simple process Low cost, easy for mass production	schematic pattern configuration on both sides Highly reliable and high-density mounting possible	High density, high multi-layering for high performanceSmaller, thinner Making light, thin, short, and small products	High frequency communication equipment (radar, satellite communication equipment) Ultra-fast backplane	Applied to small home appliances using ductility Heat resistance, durability, and strong chemical resistance	All-in-one type with both flexibility and surface mount reliability	It is called a heat dissipation metal board and is a PCB whose base material is made of metal. Excellent thermal conductivity High dielectric strength	Used in core semiconductors of mobile PC High-density circuit board with fine circuits formed	For power industry, home appliances, industrial use, Defense & Aerospace, Automotive, Applied to medical boards Very good thermal conductivity Excellent dielectric properties Excellent high temperature/high pressure reliability Strong corrosion resistance Weak to shock

📌 Scroll horizontally to access additional information.

PCB manufacturing procedure

PCB Manufacturing Process

Via hole processing

Via hole Processing

PTH	HPL	IVH	BVH	Build-up	Back Drilling	Stack-Via

Chemical plating or electroplating is applied to the inner wall of the component HOLE or conductive HOLE to allow electricity to flow between the conductor layers. Electroless PANEL PLATING	A through hole is made with copper plating in the via hole, filled with special ink, and then a second copper plating is applied on top of it. excellent conductivity Implementing a complete pad shape without surface banding	Partial via hole processing for optional circuit connection for each layer Minimize the area occupied by circuit connection holes Used in high-performance small electronic devices	This is a technology that overcomes the limitations of hole processing and plating processing by separating the layers of vias that cannot be processed due to their thickness. Reduce unnecessary inter-layer Via occupancy Shorten the height of the Via	A method of stacking conductor layers by forming insulating layers one by one VIA layer processing between each layer Capable of high-speed signal response	Removes unnecessary copper plating from the inner walls of lands and holes to improve the characteristics of circuits passing through multiple vias.	A via that electrically connects three or more floors by stacking build-up vias on top of build-up vias.
Plated Through Hole	Hole Plugging Land	Interstitial Via Hole	Blind Via Hole	Micro Via Drill	Stub Length Specification 250um±125um