반도체 칩의 전기적 특성을 검사하는 테스트 보드 및 장비에 사용되는 소켓
Package Type | FBGA, POP, QFN, QFP, SOP etc. |
Available pitch | 0.25P~ |
Characteristics | AP-Memory Bi-directional Test |
0.4P Impedance Matching | |
Coaxial Structure |
Package Type | BGA, TSOP etc. |
Pitch | 0.3P~ |
Characteristics | GPS (Device Alignment |
System), Floating Type, Hybird | |
BK Type |
Device Spec | 426FBGA_0.35P |
Signal Path | 0.35mm |
Bandwidth(@-1dB) | 34GHz |
Force / Ball | 8g |
Elastomer Thickness | 0.45mm |